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The Applied Materials (AMAT) 0190-17464 is a high-purity quartz chamber liner used as a critical consumable component in several of Applied Materials’ legacy and current-generation semiconductor fabrication platforms, including the Centura, Endura, and certain Producer series systems. Designed primarily for physical vapor deposition (PVD), chemical vapor deposition (CVD), and etch applications, this liner serves as an inner barrier between the process plasma or sputtered material and the metal walls of the vacuum chamber.
By capturing stray metal atoms, reaction byproducts, and particulates, the AMAT 0190-17464 prevents cross-contamination, reduces particle counts on wafers, and extends the time between costly chamber cleans. Made from synthetic fused quartz with ultra-low metallic impurities (<1>
This part is classified as a “process kit” item—routinely replaced during preventive maintenance (PM) cycles—and must meet strict dimensional tolerances to ensure proper fit, gas flow dynamics, and RF coupling in capacitively coupled plasma (CCP) environments. The 0190-17464 is widely used in 200mm and 300mm fabs producing logic, memory, and power devices.
Technical Specifications
| Parameter Name | Parameter Value |
|---|---|
| Part Number | 0190-17464 |
| Manufacturer | Applied Materials, Inc. (AMAT) |
| Material | High-purity synthetic fused quartz (SiO₂) |
| Purity | >99.996%, metallic impurities<1> |
| Operating Temperature | Up to 1100°C (short-term); continuous use ≤900°C |
| Thermal Shock Resistance | Excellent (ΔT >1000°C without cracking) |
| Application Platforms | Centura DxZ, Endura PVD, Producer GT, and select Centris systems |
| Wafer Compatibility | 200mm and 300mm |
| Surface Finish | Polished interior to minimize particle adhesion |
| Cleaning Status | Typically supplied ISO Class 4 cleanroom cleaned and double-bagged |
| Certification | Full material traceability, RoHS compliant, DFARS compliant (if applicable) |
Main Features and Advantages
Contamination control for high-yield manufacturing:
The AMAT 0190-17464 acts as a sacrificial layer that traps sputtered target material (e.g., Ti, Ta, Cu, Al) and reactive residues, preventing them from redepositing on subsequent wafers. This is especially critical in sub-28nm nodes where even nanometer-scale particles can cause killer defects. Its smooth quartz surface minimizes flaking and particle generation during thermal cycling.
Precision engineering for system compatibility:
Manufactured to exact OEM dimensions—including flange alignment, port cutouts, and internal contour—the 0190-17464 ensures seamless integration without requiring chamber requalification. Proper fit maintains uniform gas distribution and plasma uniformity, directly impacting film thickness consistency and step coverage.
Extended PM intervals and cost savings:
High-quality quartz with consistent wall thickness and purity allows the AMAT 0190-17464 to endure more process cycles before saturation or cracking occurs. This reduces unscheduled downtime and lowers cost-of-ownership compared to lower-grade alternatives that may require more frequent replacement or cause chamber damage.
Application Field
The AMAT 0190-17464 is predominantly used in:
Semiconductor front-end fabs: For PVD barrier/seed layers (e.g., TiN/TaN/Cu) in BEOL interconnects.
Memory production: In DRAM capacitor electrode and NAND word-line deposition modules.
Power device manufacturing: Where thick metal layers (Al, Ni) are sputtered under high-power conditions.
R&D and pilot lines: Universities and equipment developers use this liner for process development on legacy AMAT tools.
It is especially prevalent in tools running high-utilization production, where liner integrity directly correlates with mean time between cleans (MTBC) and overall equipment effectiveness (OEE).
Related Products
0190-17465: Similar quartz liner for a different chamber zone or tool variant
0190-09876: Focus ring or edge ring often replaced alongside 0190-17464 during PM
0090-75321: Aluminum chamber shield (metal alternative for non-critical zones)
0190-22103: Ceramic liner for etch chambers (different material, same function)
Endura PVD Target Assemblies: Commonly serviced at the same time as liner replacement
Centura Chamber O-Rings (e.g., 0010-4432): Seals replaced during liner maintenance
Quartz Lift Pins (e.g., 0190-15500): Other quartz consumables in the same tool family
Installation and Maintenance
Pre-installation handling:
Always handle the AMAT 0190-17464 with powder-free gloves and in a clean environment. Avoid touching the interior surface. Inspect for micro-cracks, chips, or discoloration before installation—quartz flaws can lead to catastrophic failure under vacuum/thermal stress. Ensure the chamber base is free of debris and old liner fragments.
Installation best practices:
Align locator pins carefully; forced insertion can crack the brittle quartz. Torque mounting hardware (if any) to spec—over-tightening is a common cause of breakage. Perform a leak check and dummy wafer run before returning to production. Record the serial/lot number of the new liner for PM tracking and yield correlation.
Maintenance notes:
Replace the 0190-17464 based on either cycle count or visual inspection (heavy coating, white haze, or cracks). Never attempt to clean and reuse a cracked or heavily coated liner—residual stress can cause implosion during pump-down. Store unused liners vertically in original packaging to prevent warping or surface contact.
